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49,80 €ISBN 978-3-8440-6499-5Paperback204 Seiten102 Abbildungen302 g21 x 14,8 cmEnglischDissertation
Februar 2019
Torsten Reuschel
Combined Assessment of Interconnect and Equalization in Data Links on Multilayer Printed Circuit Boards
Increasing data rates and reduced design margins oppose a detailed consideration of the diverse aspects of high-speed digital links, such as the passive channel, equalization, and coding. This work offers novel methods for the computationally efficient design and validation of links. A combined system perspective is established based on predominant physical parameters of the interconnect and key parameters of equalizer design. This enables a systematic prediction of design constraints and is accompanied by a study of advanced uncertainty quantification methods for pre- and post-layout design.
Schlagwörter: electromagnetic modeling; high-speed digital; serial links; equalization
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